Interfacial reaction of gas-atomized Sn-Zn solder containing Ni and Cu additives

S. Yagi, T. Ichitsubo, E. Matsubara, M. Yamaguchi, H. Kimura, K. Sasamori

Research output: Contribution to journalArticle

16 Citations (Scopus)

Abstract

Sn-Zn-based alloy is expected as an alternative low-temperature lead-free solder because of its melting temperature being close to that of Sn-Pb eutectic solder. The Sn-Zn solder is, however, inferior in terms of interfacial reaction with Cu substrate; that is, a hard and brittle Cu-Zn intermetallic compound (IMC) layer is formed at the joint interface, which leads to degradation of adhesion strength. In order to prevent the formation of Cu-Zn IMCs, we have investigated the effects of atomizing treatment on the Sn-Zn solders with additives Ni and Cu. In the solder containing Cu and Ni additives, the Cu-Zn IMC layer commonly observed is formed for the non-atomized solder, whereas the Cu-Sn IMC layer is formed for the atomized solder as well as Sn-Pb solder alloy. This is significant improvement for practical use of Sn-Zn based solder alloy.

Original languageEnglish
Pages (from-to)185-189
Number of pages5
JournalJournal of Alloys and Compounds
Volume484
Issue number1-2
DOIs
Publication statusPublished - 2009 Sep 18

Keywords

  • Atomization
  • Intermetallic compound
  • Lead-free solder
  • Sn-Zn
  • Solder paste

ASJC Scopus subject areas

  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

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