Interfacial reaction between Zn-Al-based high-temperature solders and Ni substrate

Yoshikazu Takaku, Komei Makino, Keita Watanabe, Ikuo Ohnuma, Ryosuke Kainuma, Yasushi Yamada, Yuji Yagi, Ikuo Nakagawa, Takashi Atsumi, Kiyohito Ishida

Research output: Contribution to journalArticlepeer-review

43 Citations (Scopus)

Abstract

The Zn-Al(-Cu) eutectic alloys (melting point 381°C) are candidates for use as Pb-free high-temperature solders as a substitute for Pb-based solders, which are suitable for severe working environments such as the engine room of hybrid vehicles equipped with an inverter system as well as a heat engine. In this study, the interfacial reaction between Zn-Al(-Cu) alloys and the Ni substrate during soldering, aging, and thermal cycling was investigated. Semiconductor chips and Ni substrates were soldered with Zn-Al(-Cu) alloys at various temperatures under a nitrogen atmosphere. The soldered assemblies were then heat-treated at 200°C and 300°C to examine the microstructural evolution at the soldered interface. The effect of severe thermal cycles between -40°C and 250°C in air on the microstructure and fracture behavior at the solder joint was investigated. Even after a 1000-cycle test, the thickness of the Al 3Ni 2 layer formed at the interface between the Zn-Al-based solder and the Ni substrate, which is responsible for the damage of the soldered assemblies, was quite small.

Original languageEnglish
Pages (from-to)54-60
Number of pages7
JournalJournal of Electronic Materials
Volume38
Issue number1
DOIs
Publication statusPublished - 2009 Jan 1

Keywords

  • Interfacial reaction
  • Intermetallic compound
  • Ni substrate
  • Thermal cycling test
  • Zn-Al-Cu solder

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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