Interfacial reaction between Cu substrates and Zn-Al base high-temperature Pb-free solders

Yoshikazu Takaku, Lazuardi Felicia, Ikuo Ohnuma, Ryosuke Kainuma, Kiyohito Ishida

Research output: Contribution to journalArticlepeer-review

70 Citations (Scopus)

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Engineering & Materials Science

Chemical Compounds

Physics & Astronomy