Interfacial reaction and morphology between molten Sn base solders and Cu substrate

Yoshikazu Takaku, Xing Jun Liu, Ikuo Ohnuma, Ryosuke Kainuma, Kiyohito Ishida

Research output: Contribution to journalArticlepeer-review

45 Citations (Scopus)

Fingerprint Dive into the research topics of 'Interfacial reaction and morphology between molten Sn base solders and Cu substrate'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science

Physics & Astronomy