Interface structure between Ti-based bulk metallic glasses and hydroxyapatite ceramics jointed by hydrothermal techniques

Takamasa Onoki, Taisuke Higashi, Xinmin Wang, Shengli Zhu, Naota Sugiyama, Yasuto Hoshikawa, Masaru Akao, Nobuhiro Matsushita, Atsushi Nakahira, Eiichi Yasuda, Masahiro Yoshimura, Akihisa Inoue

    Research output: Contribution to journalArticlepeer-review

    2 Citations (Scopus)


    The authors successfully formed a bond between bioactive hydroxyapatite (HA) ceramics and titanium (Ti)-based bulk metallic glasses (Ti 40Zr10Cu36Pd14: BMG) through a growing integrated layer (GIL) to develop a new type of biomaterial. The GILs were formed on the BMG surfaces by hydrothermal-electrochemical (HE) techniques. The BMG substrates were treated in a 5 mol/L NaOH solution at 90°C for 600, 2400 and 7200 seconds while a constant electric current of 50 mA/mm2 was maintained between the electrodes. Then the BMG disks with the GIL and a powder mixture of calcium phosphate di-hydrate (CaHPO4-2H 2O) and calcium hydroxide (Ca(OH)2) were simultaneously treated with an autoclave for hydrothermal hot-pressing (HHP) (150° C, 40 MPa, 7.2 ks). Direct bonding between the HA ceramics and the BMG disks could be achieved through the above processing method. Scanning electron microscopy observations was conducted around the interface between BMG and HA. The bonding model of the bonding BMG and HA was suggested. The bonding was achieved through the amorphous nano-meshed layer consumption during the HHP processing. Sufficient thickness of GIL derived from hydrothermal-electrochemical treatment for over 2.4 ks is needed for the bonding.

    Original languageEnglish
    Pages (from-to)1308-1312
    Number of pages5
    JournalMaterials Transactions
    Issue number6
    Publication statusPublished - 2009 Jun


    • Biomaterials
    • Ceramics coatings
    • Electrochemical
    • Hydrothermal

    ASJC Scopus subject areas

    • Materials Science(all)
    • Condensed Matter Physics
    • Mechanics of Materials
    • Mechanical Engineering


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