Interface microstructure of aluminum die-casting alloy joints bonded by pulse electric-current bonding process

Guoqiang Xie, Osamu Ohashi, Kouji Wada, Takayuki Ogawa, Minghui Song, Kazuo Furuya

    Research output: Contribution to journalArticlepeer-review

    3 Citations (Scopus)

    Abstract

    Aluminum die-casting alloy specimens were bonded by a pulse electric-current bonding (PECB) process using insert alloy powders containing 1 mass% Mg into interface between two bonded specimens. Microstructure of the bonded joints was characterized and analyzed by scanning electron microscopy (SEM), transmission electron microscopy (TEM) and X-ray energy dispersive spectroscopy (EDS). The results proposed that insert alloy powders containing Mg was an effective technique for solid-state bonding of aluminum alloy specimens containing neither Mg nor other active elements. The reason of the tensile property improvement of the joint bonded by the insert alloy powders was that continuous oxide films originally covered at aluminum alloy surface were broken and removed by reduction reaction of Mg in the inserted alloy powders. This promoted metal-metal contacts, and thereby solid-state bonding of aluminum alloy specimens was facilitated.

    Original languageEnglish
    Pages (from-to)12-17
    Number of pages6
    JournalMaterials Science and Engineering A
    Volume428
    Issue number1-2
    DOIs
    Publication statusPublished - 2006 Jul 25

    Keywords

    • Die-casting alloy
    • Insert powder
    • Microstructure
    • Oxide film
    • Pulse electric-current bonding

    ASJC Scopus subject areas

    • Materials Science(all)
    • Condensed Matter Physics
    • Mechanics of Materials
    • Mechanical Engineering

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