Integration of single-walled carbon nanotube bundle on cantilever by dielectrophoresis

T. Chikamoto, Y. Shimada, M. Umetsu, M. Sugiyama

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

We report on the assembly process for single-walled carbon nanotubes (SW-CNTs) bundle on the tip of cantilever for atomic force microscopy (AFM) by dielectrophoresis (DEP). In DEP process, an ac electric field (20 V p-p, 5 MHz) was applied between a tungsten probe and the cantilever tip to form the SW-CNTs bundle bridge. We can monitor the SW-CNTs bridging process in real time under an optical microscope and successfully assembled SW-CNTs bundle with a diameter of approximately 100 nm on the tip. To compare the performance of our fablicated CNT cantilever with conventional cantilevers, we scanned a porous aluminum surface using AFM. From AFM measurements, we confirmed that our cantilever by DEP allowed us to obtain high resolution images similarly to conventional cantilevers with strong mechanical strength and good stability of scanning.

Original languageEnglish
Title of host publicationIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
Pages319-322
Number of pages4
DOIs
Publication statusPublished - 2013 Apr 2
EventIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013 - Taipei, Taiwan, Province of China
Duration: 2013 Jan 202013 Jan 24

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

OtherIEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
CountryTaiwan, Province of China
CityTaipei
Period13/1/2013/1/24

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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