Integration and packaging technology of MEMS-on-CMOS tactile sensor for robot application using molded thick BCB layer and backside-grooved electrical connection

M. Makihata, S. Tanaka, M. Muroyama, S. Matsuzaki, H. Yamada, T. Nakayama, U. Yamaguchi, K. Mima, Y. Nonomura, M. Fujiyoshi, M. Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Fingerprint Dive into the research topics of 'Integration and packaging technology of MEMS-on-CMOS tactile sensor for robot application using molded thick BCB layer and backside-grooved electrical connection'. Together they form a unique fingerprint.

Engineering & Materials Science