Integration and packaging technology of MEMS-on-CMOS tactile sensor for robot application using molded thick BCB layer and backside-grooved electrical connection

M. Makihata, S. Tanaka, M. Muroyama, S. Matsuzaki, H. Yamada, T. Nakayama, U. Yamaguchi, K. Mima, Y. Nonomura, M. Fujiyoshi, M. Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

This paper describes a novel integration and packaging process for a chip-size-packaged integrated tactile sensor. A MEMS wafer and a CMOS wafer were bonded with a thick (50 μm thick) BCB (benzocyclobutene) layer, which also works as the dielectric layer of sensing electrodes. The large thickness is advantageous to reduce parasitic capacitance to the CMOS circuit. The thick BCB layer was formed on the CMOS wafer and molded with a glass mold to make a flat surface with via holes. For surface mounting, bond pads are located on the backside of the senor chip by drawing electrical feed lines through the chip edge. To make the feed lines in wafer level, tapered grooves were fabricated along the scribe lines by TMAH wet etching, and half dicing was done along the grooves to access electrodes on the BEOL layer. Finally, the tactile senor was completed and preliminarily evaluated.

Original languageEnglish
Title of host publication2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
Pages815-818
Number of pages4
DOIs
Publication statusPublished - 2011 Sep 1
Event2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 - Beijing, China
Duration: 2011 Jun 52011 Jun 9

Publication series

Name2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11

Other

Other2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
CountryChina
CityBeijing
Period11/6/511/6/9

Keywords

  • BCB
  • CMOS integration
  • Chip-size packaging
  • Molding
  • Tactile senor

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Integration and packaging technology of MEMS-on-CMOS tactile sensor for robot application using molded thick BCB layer and backside-grooved electrical connection'. Together they form a unique fingerprint.

Cite this