Integrated MEMS by adhesive bonding

Masayoshi Esashi, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. MEMS devices of films formed on a carrier wafer are transferred on a LSI wafer, which makes versatile heterogeneous integration possible. Film transfer processes and device transfer processes have been developed and applied to resonator, piezoelectric switch, tactile sensor, electron source. Selective bonding to transfer devices on one carrier wafer to multiple LSI wafers has been developed.

Original languageEnglish
Title of host publicationIEEE SENSORS 2013 - Proceedings
PublisherIEEE Computer Society
ISBN (Print)9781467346405
DOIs
Publication statusPublished - 2013
Event12th IEEE SENSORS 2013 Conference - Baltimore, MD, United States
Duration: 2013 Nov 42013 Nov 6

Publication series

NameProceedings of IEEE Sensors

Other

Other12th IEEE SENSORS 2013 Conference
CountryUnited States
CityBaltimore, MD
Period13/11/413/11/6

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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