TY - JOUR
T1 - Integrated 3-axis tactile sensor using quad-seesaw-electrode structure on platform LSI with through silicon vias
AU - Hata, Yoshiyuki
AU - Suzuki, Yukio
AU - Muroyama, Masanori
AU - Nakayama, Takahiro
AU - Nonomura, Yutaka
AU - Chand, Rakesh
AU - Hirano, Hideki
AU - Omura, Yoshiteru
AU - Fujiyoshi, Motohiro
AU - Tanaka, Shuji
N1 - Funding Information:
Rakesh Chand received Bachelors of Science in Physics (Hons.) and Master of Science in Physics from University of Delhi in 2003 and Choudhary Charan Singh University in 2007 respectively. He received M.Tech degree in Microelectronics from Indian Institute of Information Technology in 2010 and PhD in 2015 from Department of Bioengineering and Robotics, Tohoku University Japan. He did his postdoctoral research at Microsystem Integration Center, Tohoku University Japan. Since 2017, he is working as Principal Engineer (MEMS- Technology Development) at Global foundries Singapore. He is a recipient of Monbukagakusho (MEXT) Scholarship by Minister of Education, Culture, Sports, Science and Technology, Government of Japan. He is a member of IEEE and JSAP. His research interest includes high temperature SiC electronics and sensors, power MEMS, RF MEMS and MEMS Packaging.
Publisher Copyright:
© 2018 Elsevier B.V.
PY - 2018/4/15
Y1 - 2018/4/15
N2 - This paper reports a MEMS-on-LSI integrated tactile sensor for robot applications that has both fully differential capacitive 3-axis force sensing and signal processing in a single chip. The MEMS part is composed of a quad-seesaw-electrode structure that senses 3-axis force with fully differential capacitive detection. The LSI part is an original sensor platform LSI that enables signal processing and serial bus communication for various types of sensors. The sensor platform LSI was processed for the MEMS-on-LSI integration after fabrication in a semiconductor foundry; the additional processing formed 300-μm-deep annular-type through silicon vias (TSVs), a bonding ring, and sensor electrodes. By Au-Au thermocompression bonding of the fabricated MEMS and LSI parts, a 2.8-mm-square surface-mountable MEMS-on-LSI integrated tactile sensor was completed. A working test demonstrated that digital packet transmission through TSV and confirmed the working principle of 3-axis force sensing with fully differential capacitive detection. A fully integrated and fully differential 3-axis tactile sensor was achieved on a single chip.
AB - This paper reports a MEMS-on-LSI integrated tactile sensor for robot applications that has both fully differential capacitive 3-axis force sensing and signal processing in a single chip. The MEMS part is composed of a quad-seesaw-electrode structure that senses 3-axis force with fully differential capacitive detection. The LSI part is an original sensor platform LSI that enables signal processing and serial bus communication for various types of sensors. The sensor platform LSI was processed for the MEMS-on-LSI integration after fabrication in a semiconductor foundry; the additional processing formed 300-μm-deep annular-type through silicon vias (TSVs), a bonding ring, and sensor electrodes. By Au-Au thermocompression bonding of the fabricated MEMS and LSI parts, a 2.8-mm-square surface-mountable MEMS-on-LSI integrated tactile sensor was completed. A working test demonstrated that digital packet transmission through TSV and confirmed the working principle of 3-axis force sensing with fully differential capacitive detection. A fully integrated and fully differential 3-axis tactile sensor was achieved on a single chip.
KW - 3-axis force sensing
KW - MEMS-on-LSI integration
KW - Quad-seesaw-electrode structure
KW - Sensor platform LSI
KW - Tactile sensor
KW - Through silicon via
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U2 - 10.1016/j.sna.2018.02.013
DO - 10.1016/j.sna.2018.02.013
M3 - Article
AN - SCOPUS:85042199165
VL - 273
SP - 30
EP - 41
JO - Sensors and Actuators, A: Physical
JF - Sensors and Actuators, A: Physical
SN - 0924-4247
ER -