Inhibitation of substrate heating in a minimal multi-target helicon sputtering tool

Taichi Saito, Kazunori Takahashi, Akira Ando, Shiro Hara

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A minimal multi-target helicon sputtering tool has been developed for depositing a multi-layer metallic film in Minimal Fab System. In sputtering processes, high energy charged particles and recoil neutrals often flow into the substrate, resulting in an increase in a substrate temperature. Here the substrate temperature is investigated in a laboratory prototype of the minimal multi-target sputtering tool. Our experiment shows that the increase in the temperature can be successfully inhibited by installing a magnetic filter. This result implies that the increase in the substrate temperature is induced by secondary electrons from the target surface.

Original languageEnglish
Title of host publication2018 International Symposium on Semiconductor Manufacturing, ISSM 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538662687
DOIs
Publication statusPublished - 2019 Feb 22
Event2018 International Symposium on Semiconductor Manufacturing, ISSM 2018 - Tokyo, Japan
Duration: 2018 Dec 102018 Dec 11

Publication series

NameIEEE International Symposium on Semiconductor Manufacturing Conference Proceedings
Volume2018-December
ISSN (Print)1523-553X

Conference

Conference2018 International Symposium on Semiconductor Manufacturing, ISSM 2018
CountryJapan
CityTokyo
Period18/12/1018/12/11

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Engineering(all)
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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