Influence of two-step ball-milling condition on electrical and mechanical properties of TiC-dispersion-strengthened Cu alloys

Fenglin Wang, Yunping Li, Kenta Yamanaka, Kimio Wakon, Koichi Harata, Akihiko Chiba

Research output: Contribution to journalArticle

28 Citations (Scopus)

Abstract

TiC-dispersion-strengthened Cu alloys were prepared by a two-step ball-milling (BM) process followed by sparks plasma sintering (SPS), heat treatment and hot rolling in sequence. The two-step BM process is composed of a pre-ball-milling (pre-BM) on both Ti and graphite powders as well as a subsequent homogenizing by BM together with Cu powder. Microstructure evolution analysis was performed to evaluate the effects of BM conditions on the electrical and mechanical properties of Cu-based alloys. The X-ray results revealed that titanium carbide (TiC) formed from Ti and C under high impact energy BM. Moreover, the formation of TiC during the SPS and heat treatment processes was found to more beneficial in enhancing the mechanical properties of alloy. The residual Ti in Cu matrix was found to be the predominant factor lowering the electrical conductivity of Cu-Ti-C alloys.

Original languageEnglish
Pages (from-to)441-449
Number of pages9
JournalMaterials and Design
Volume64
DOIs
Publication statusPublished - 2014 Dec 1

Keywords

  • Dispersion-strengthened copper alloy
  • In-situ reaction
  • Two-step ball-milling

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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