Influence of Sb additions on surface tension and density of Sn-Sb, Sn-Ag-Sb and Sn-Ag-Cu-Sb alloys: Experiment vs. modeling

Z. Moser, W. Gasior, J. Pstruś, Ikuo Ohnuma, K. Ishida

Research output: Contribution to journalArticlepeer-review

14 Citations (Scopus)

Abstract

Surface tension and density measurements by maximum bubble pressure and dilatometric techniques were carried out in an extensive range of temperature on liquid alloys close to the ternary eutectic Sn3.3Ag0.76Cu with different Sb content. It has been found that the addition of Sb to Sn, Sn-Sb, to binary eutectic Sn-Ag and to Sn3.3Ag0.76Cu decreases the surface tension and density. The values of the surface tension calculated by the Butler model and by the method based on the binary alloys surface tension data with the ternary and quaternary correction factors were compared with the experimental results. The best agreement between the measured and the calculated values was observed for the model comprising the binary data with the correction factors.

Original languageEnglish
Pages (from-to)365-370
Number of pages6
JournalInternational Journal of Materials Research
Volume97
Issue number4
Publication statusPublished - 2006 Apr 1

Keywords

  • Density
  • Modeling
  • Pb-free solders
  • Surface tension

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Physical and Theoretical Chemistry
  • Metals and Alloys
  • Materials Chemistry

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