Abstract
The ultra clean sputtering process (UC-process) was introduced in the fabrication of thin film media and spin valve type Ni-Fe/25 at% Ni-Mn/Ni-Fe tri-layered films. As a result, the UC process enables the control of the fine structure of the thin films and resulted in excellent magnetic properties. This study demonstrates that the UC-process is superior to the normal process presently used and plays an important role for the thin film media and spin valve head fabrication.
Original language | English |
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Pages (from-to) | 851-855 |
Number of pages | 5 |
Journal | Shinku/Journal of the Vacuum Society of Japan |
Volume | 41 |
Issue number | 10 |
DOIs | |
Publication status | Published - 1998 Oct |
ASJC Scopus subject areas
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Electrical and Electronic Engineering