The ultra clean sputtering process (UC-process) was introduced in the fabrication of thin film media and spin valve type Ni-Fe/25 at% Ni-Mn/Ni-Fe tri-layered films. As a result, the UC process enables the control of the fine structure of the thin films and resulted in excellent magnetic properties. This study demonstrates that the UC-process is superior to the normal process presently used and plays an important role for the thin film media and spin valve head fabrication.
ASJC Scopus subject areas
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Electrical and Electronic Engineering