Abstract
The relationship between the structural property and the electrical characteristics of thin SiO2 below 4 nm is investigated. The structural `strained-layer' near SiO2/Si interface is confirmed to affect strongly the TDDB (Time Dependent Dielectric Breakdown) lifetime of the thin gate oxides. The increase of the built-in compressive strain analyzed by the XPS (X-ray Photoelectron Spectroscopy)-based technique is experimentally found to decrease the TDDB lifetime.
Original language | English |
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Pages (from-to) | 175-178 |
Number of pages | 4 |
Journal | Technical Digest - International Electron Devices Meeting |
Publication status | Published - 1998 Dec 1 |
Externally published | Yes |
Event | Proceedings of the 1998 IEEE International Electron Devices Meeting - San Francisco, CA, USA Duration: 1998 Dec 6 → 1998 Dec 9 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry