Abstract
The grain boundary groove at the crystal/melt interface in pure Cu was observed in situ to measure the grain boundary energy at the melting temperature. It was observed that the shape of the groove changed upon solidification even though the planar crystal/melt interface was maintained. The crystal/melt interface was kept in equilibrium through precise control of the temperature, which enabled the measurement of the grain boundary energy on the basis of the shape of the equilibrated groove. The low-angle grain boundary energy at the melting temperature of Cu was obtained.
Original language | English |
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Pages (from-to) | 169-172 |
Number of pages | 4 |
Journal | Scripta Materialia |
Volume | 146 |
DOIs | |
Publication status | Published - 2018 Mar 15 |
Keywords
- Crystal/melt interface
- Grain boundary energy
- Low-angle grain boundary
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
- Metals and Alloys