Improving the adhesion of electroless-nickel coating layer on diamond powder

J. G. Ahn, D. J. Kim, J. R. Lee, H. S. Chung, C. O. Kim, H. T. Hai

Research output: Contribution to journalArticle

31 Citations (Scopus)

Abstract

An electroless-nickel plating method with semi-batch reactor was employed to coat diamond powders. Ni-P fines are known to be a main cause for generating pore structure in the nickel coating layer was eliminated by lowering the rate of reduction by means of temperature, pH and feeding rate of reductant. It was found that at a temperature of 70 °C, pH of 4.8, feeding rate of reductant of 0.25 ml/min the Ni-P fines were entirely eliminated, resulting in a rapid improvement of diamond-coated nickel layer adhesion.

Original languageEnglish
Pages (from-to)3793-3796
Number of pages4
JournalSurface and Coatings Technology
Volume201
Issue number6
DOIs
Publication statusPublished - 2006 Dec 4

Keywords

  • Adhesion
  • Coating
  • Nickel-diamond composite
  • Surface characterization

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

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  • Cite this

    Ahn, J. G., Kim, D. J., Lee, J. R., Chung, H. S., Kim, C. O., & Hai, H. T. (2006). Improving the adhesion of electroless-nickel coating layer on diamond powder. Surface and Coatings Technology, 201(6), 3793-3796. https://doi.org/10.1016/j.surfcoat.2006.05.029