Improvements in thermal stability of cobalt-silicide films by adding nickel

Engineering & Materials Science

• Silicides 100%
• Cobalt 84%
• Thermodynamic stability 75%
• Nickel 68%
• Atoms 50%
• Molecular dynamics 41%
• Sheet resistance 33%
• Agglomeration 31%
• Computer simulation 20%
• Substrates 17%
• Semiconductor devices 14%
• Activation energy 12%
• X ray diffraction 11%
• Textures 9%
• Silicon 9%
• Networks (circuits) 6%

Physics & Astronomy

• silicides 75%
• cobalt 68%
• thermal stability 63%
• nickel 58%
• agglomeration 39%
• molecular dynamics 26%
• atoms 24%
• digits 15%
• simulation 13%
• semiconductor devices 12%
• textures 10%
• activation energy 8%
• silicon 6%
• diffraction 6%
• x rays 5%

Chemical Compounds

• Thermal Stability 48%
• Agglomeration 35%
• Diffusion 30%
• Sheet Resistance 29%
• Molecular Dynamics 26%
• Simulation 23%
• Cobalt Atom 15%
• Crystalline Texture 11%
• Reaction Activation Energy 8%