Improvement of the reliability of TSV interconnections by controlling the crystallinity of electroplated copper thin films

Ryosuke Furuya, Chuanhong Fan, Osamu Asai, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

The degradation process of the crystallinity of electroplated copper thin films, which are used for interconnections and micro bumps for 3D integration, during electromigration and stress-induced migration tests was observed clearly by applying an EBSD method. The grain boundary diffusion was the main reason for the degradation of the crystallographic quality in both grain boundaries and grains. The reliability of the interconnections was improved drastically by minimizing the lattice mismatch between the electroplated copper and its base material for electroplating. The large mismatch deteriorated the crystallographic quality of the electroplated copper thin films and thus, increased the shrinkage rate of the films caused by the annealing. The electronic resistivity of the crystallinity-controlled films decreases effectively, and their lives during electromigration test improved drastically. In addition, the residuals stress in the films annealed at 400°C decreased to the stress lower than their yielding stress, and therefore, no stress-induced migration was observed. These results clearly indicate that the control of the crystallinity of metallic interconnectionis indispensable for assuring their long-life reliability.

Original languageEnglish
Title of host publication2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
Pages635-640
Number of pages6
DOIs
Publication statusPublished - 2013
Event2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 - Las Vegas, NV, United States
Duration: 2013 May 282013 May 31

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
CountryUnited States
CityLas Vegas, NV
Period13/5/2813/5/31

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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