Improvement of the reliability of thin-film interconnections based on the control of the crystallinity of the thin films

Osamu Asai, Naokazu Murata, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

In this study, the degradation mechanism of electronic performance of electroplated copper interconnections was investigated by considering their crystallinity of grain boundaries. The crystallinity of the interconnections was evaluated quantitatively by applying an EBSD (Electron Back-scattered Diffraction) method. It was found that the crystallinity of the interconnections varied drastically depending on the seed layer material for electroplating. A new design guideline for highly reliable electroplated copper thin film interconnections was proposed based on the measured results.

Original languageEnglish
Title of host publication14th International Conference on Electronic Materials and Packaging, EMAP 2012
DOIs
Publication statusPublished - 2012 Dec 1
Event14th International Conference on Electronic Materials and Packaging, EMAP 2012 - Lantau Island, Hong Kong
Duration: 2012 Dec 132012 Dec 16

Publication series

Name14th International Conference on Electronic Materials and Packaging, EMAP 2012

Other

Other14th International Conference on Electronic Materials and Packaging, EMAP 2012
Country/TerritoryHong Kong
CityLantau Island
Period12/12/1312/12/16

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

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