Improvement of the crystallinity of electroplated copper thin films for highly reliable 3D interconnections

Chuanhong Fan, Osamu Asai, Ryosuke Furuya, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The degradation process of the crystallographic quality of copper thin films, which are used for interconnections and micro bumps for 3D integration, during electromigration and stress-induced migration tests is dominated by the diffusion along grain boundaries and the diffusion constant of copper varies drastically depending on the crystallinity of the films. The degradation process was visualized clearly by applying an electron back-scatter diffraction method. The copper atoms in the electroplated copper thin films migrated mainly in the area with low crystallinity, in other words, the area with high defect density. Since the crystallinity of the films was found to be dominated by the lattice mismatch between copper and the seed layer material used for electroplating, the integrity of the interface structure was improved by minimizing the lattice mismatch. It was validated that the introducing the thin layer with fine grains and random orientation is effective for minimizing the lattice mismatch and thus, improving the crystallographic quality of the electroplated copper thin-film interconnections.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1885-1890
Number of pages6
ISBN (Electronic)9781479924073
DOIs
Publication statusPublished - 2014 Sep 11
Event64th Electronic Components and Technology Conference, ECTC 2014 - Orlando, United States
Duration: 2014 May 272014 May 30

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other64th Electronic Components and Technology Conference, ECTC 2014
CountryUnited States
CityOrlando
Period14/5/2714/5/30

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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