Improvement of Interfacial Strength with the Addition of Ni in Al/Cu Dissimilar Joints Produced via Laser Brazing

H. S. Furuya, Y. S. Sato, Hiroyuki Kokawa, T. Huang, R. S. Xiao

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Dissimilar metal joining between Al and Cu is effective to reduce the cost and weight of electrical components. In this study, dissimilar laser lap brazing of Al containing Ni to pure Cu was conducted, and the effect of the addition of Ni on the joint strength and microstructure at the dissimilar interface was examined. The addition of Ni higher than 2.8 at. pct improved the joint strength effectively, even though the thickness of the IMC layer at the dissimilar interface increased. The addition of Ni additionally produced not only (Ni,Cu)Al particles in θ-Al2Cu but also a (Ni,Cu)Al layer at the θ-Al2Cu/γ1-Al4Cu9 interface. This study implied that the addition of Ni to Al resulted in the formation of a (Ni,Cu)Al layer at the weakest interface between θ-Al2Cu and γ1-Al4Cu9, drastically increasing the strength of the Al/Cu dissimilar joint.

Original languageEnglish
Pages (from-to)6215-6223
Number of pages9
JournalMetallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Volume49
Issue number12
DOIs
Publication statusPublished - 2018 Dec 1

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys

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