Improvement of Fundamental Technology of 3-D Thermal Compression Bonding with High Accuracy

Kohei Seyama, Shoji Wada, Yuji Eguchi, Doug Day, Shigetoshi Sugawa

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Improvement of Fundamental Technology of 3-D Thermal Compression Bonding with High Accuracy'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemical Compounds