Improved wettability of Sn-based solder over the Cu60Zr 30Ti10 bulk metallic glass surface

A. Imai, M. Katayama, S. Maruyama, H. Nishikawa, T. Wada, H. Kimura, M. Fukuhara, T. Takemoto, A. Inoue, Y. Matsumoto

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)


The wettability of Pb-free Sn-based solder over the Cu-based Cu 60Zr30Ti10 bulk metallic glass surface was investigated. We observed that the as-polished surface was nonwetting for the solder, which was due to the surface oxide layer of ZrOx formed in air. After complete removal of the oxide layer, a thin layer of Ag was deposited on the clean Cu60Zr30Ti10 surface. The Ag-covered Cu60Zr30Ti10 surface showed relatively high resistivity to the reoxidation even in air, and thus the wettability of the Cu60Zr30Ti10 surface for the Sn-based solder was greatly improved.

Original languageEnglish
Pages (from-to)2931-2934
Number of pages4
JournalJournal of Materials Research
Issue number9
Publication statusPublished - 2009 Sep

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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