Impacts of static and dynamic local bending of thinned Si chip on MOSFET performance in 3-D stacked LSI

H. Kino, J. C. Bea, M. Murugesan, K. W. Lee, T. Fukushima, M. Koyanagi, T. Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

A three-dimensional (3-D) LSI has many lots of through-Si vias (TSVs) and metal microbumps to achieve electrical connections between stacked thinned LSI chips, and also has organic adhesives to obtain completely bonded thinned LSI chips. However, these elements, especially microbumps and organic adhesives, induce static and dynamic local bending of the thinned LSI chips. In this study, for the first time, we investigated impacts of the static and dynamic local bending on MOSFET characteristics using a novel test structure.

Original languageEnglish
Title of host publication2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
Pages360-365
Number of pages6
DOIs
Publication statusPublished - 2013 Sep 9
Event2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 - Las Vegas, NV, United States
Duration: 2013 May 282013 May 31

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
CountryUnited States
CityLas Vegas, NV
Period13/5/2813/5/31

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Impacts of static and dynamic local bending of thinned Si chip on MOSFET performance in 3-D stacked LSI'. Together they form a unique fingerprint.

  • Cite this

    Kino, H., Bea, J. C., Murugesan, M., Lee, K. W., Fukushima, T., Koyanagi, M., & Tanaka, T. (2013). Impacts of static and dynamic local bending of thinned Si chip on MOSFET performance in 3-D stacked LSI. In 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 (pp. 360-365). [6575596] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2013.6575596