Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO2 for Low-Temperature TSV Liner Formation

Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara, Murugesan Mariappan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Through-silicon vias (TSVs) is one of the key technologies for 3D integration. To solve the issues induced by the high-Temperature process for TSV liner formation in the multichip-To-wafer (MCtW) process, we applied the low-Temperature SiO2 deposition method called OER (Ozone-Ethylene Radical generation)-TEOS-CVD®. In this study, we fabricated the MIS capacitors with the TSV liner deposited by OER-TEOS-CVD® at 150°C and room temperature (RT), and compared both the coverage and electrical characteristics with that formed by conventional plasma-enhanced chemical vapor deposition (PE-CVD) at 200°C. Furthermore, we analyzed these SiO2liners by FTIR and synchrotron XPS. These results showed that the OER-TEOS-CVD® has high potentials to realize highly-reliable TSVs and to apply to various processes in 3D integration.

Original languageEnglish
Title of host publicationIEEE 2019 International 3D Systems Integration Conference, 3DIC 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728148700
DOIs
Publication statusPublished - 2019 Oct
Event2019 IEEE International 3D Systems Integration Conference, 3DIC 2019 - Sendai, Japan
Duration: 2019 Oct 82019 Oct 10

Publication series

NameIEEE 2019 International 3D Systems Integration Conference, 3DIC 2019

Conference

Conference2019 IEEE International 3D Systems Integration Conference, 3DIC 2019
CountryJapan
CitySendai
Period19/10/819/10/10

Keywords

  • SiO2
  • TSVs
  • liner dielectric
  • low-Temperature CVD

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials

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