Impacts of Cu contamination on device reliabilities in 3-D IC integration

Kang Wook Lee, Ji Chel Bea, Yuki Ohara, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Contribution to journalArticlepeer-review

13 Citations (Scopus)

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Chemical Compounds

Engineering & Materials Science