Impacts of Cu contamination in 3D integration process on memory retention characteristics in thinned DRAM chip

Kangwook Lee, Seiya Tanikawa, Hideki Naganuma, Jichoru Be, Mariappine Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

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Engineering & Materials Science