Impact of remnant stress/strain and metal contamination in 3D-LSIs with through-Si vias fabricated by wafer thinning and bonding

M. Murugesan, J. C. Bea, H. Kino, Y. Ohara, T. Kojima, A. Noriki, K. W. Lee, K. Kiyoyama, T. Fukushima, H. Nohira, Takeo Hattori, E. Ikenaga, T. Tanaka, M. Koyanag

Research output: Chapter in Book/Report/Conference proceedingConference contribution

26 Citations (Scopus)

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