Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding

Mariappan Murugesan, Yuki Ohara, Jichoru Be, Kanuku Ri, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

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Engineering & Materials Science