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Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding
Mariappan Murugesan, Yuki Ohara, Jichoru Be, Kanuku Ri, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
4
Citations
(Scopus)