IC package and bonding wire modeling software and its application to RFIC design

Kenji Goto, Aleksander Dec, Yoshihiko Horio, Ken Suyama, Hiroshi Akima

Research output: Contribution to journalArticle

Abstract

This paper presents an IC package and bonding wire modeling software which generates an equivalent lumped circuit model from physical information of IC package and bonding wires. The resulting model takes into account the effects of frequency-dependent resistance, capacitance, as well as self and mutual inductance. The accuracy of the modeling approach has been verified using a 20-pin lead-less plastic chip carrier package. Furthermore, the application of the IC package characterization software to the design of a 700 MHz CMOS VCO has also been demonstrated.

Original languageEnglish
Pages (from-to)2109-2112
Number of pages4
JournalIEEE MTT-S International Microwave Symposium Digest
Volume3
DOIs
Publication statusPublished - 2002 Jan 1
Externally publishedYes

ASJC Scopus subject areas

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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