IC chip level low noise technology for high speed and high quality telecommunication systems

Masahiro Yamaguchi, Satoshi Tanaka, Yasushi Endo, Makoto Nagata, Hiroaki Matsui, Mizuki Iwanami, Kenta Tsukamoto

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Single chip integration of RF frontend and digital backend circuits is an obvious solution to accommodate high sensitivity and selectivity of analogue RF chains, and the high speed and large data bandwidth digital processing in an RF IC for the coming wireless communication systems including long-term evolution-advanced (LTE-A) system. This paper firstly emphasizes the necessity to suppress intra electromagnetic coupling from digital to RF circuits within the bandwidth of wireless channels. Our approach to suppress IC chip level RF noise coupling and to estimate their impact on system-level performance of wireless communication lead to major achievements on; (a)development of an in-system diagnosis platform of RF ICs consisting of a silicon emulator of on-chip interferers and a system-level RF performance simulator, (b)measurement-based substrate noise coupling analysis, measurement-based magnetic air coupling analysis, (c)an unique ferromagnetic on-chip countermeasure, and (d)board level coupling analysis in LTE receiver communication band. Their impacts on future telecommunication systems are estimated to conclude this work.

Original languageEnglish
Title of host publication2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages540-542
Number of pages3
ISBN (Electronic)9784902339314
Publication statusPublished - 2014 Mar 25
Event2014 Asia-Pacific Microwave Conference, APMC 2014 - Sendai, Japan
Duration: 2014 Nov 42014 Nov 7

Publication series

Name2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014

Other

Other2014 Asia-Pacific Microwave Conference, APMC 2014
CountryJapan
CitySendai
Period14/11/414/11/7

Keywords

  • APD
  • Magnetic thin film
  • RFIC
  • Spurious noise
  • Substrate coupling
  • Wireless communication

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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  • Cite this

    Yamaguchi, M., Tanaka, S., Endo, Y., Nagata, M., Matsui, H., Iwanami, M., & Tsukamoto, K. (2014). IC chip level low noise technology for high speed and high quality telecommunication systems. In 2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014 (pp. 540-542). [7067831] (2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014). Institute of Electrical and Electronics Engineers Inc..