Humidification effect of air plasma effluent gas on suppressing conidium germination of a plant pathogenic fungus in the liquid phase

Keisuke Shimada, Keisuke Takashima, Yutaka Kimura, Kenji Nihei, Hideaki Konishi, Toshiro Kaneko

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)

Abstract

Increase of the water flow rate into atmospheric pressure air discharge plasma for humidification can significantly improve suppressing conidium germination of a plant pathogenic fungus in the liquid phase by its effluent gas exposure. The role of the introduced water includes enhancement of hydrogen supply to the plasma and cooling of the plasma effluent gas. The hydrogen-containing precursors for antibacterial species generation are experimentally increased. The gas cooling by the latent heat assists dinitrogen pentoxide density in the gas phase, a suggested precursor for antibacterial species generation near the liquid surface. This suggested near-surface reaction is a second-order reaction, generally requiring lower precursors concentrations and leading to less residues, thus it can be an important process for agricultural applications.

Original languageEnglish
Article number1900004
JournalPlasma Processes and Polymers
Volume17
Issue number1
DOIs
Publication statusPublished - 2020 Jan 1

Keywords

  • air plasma effluent
  • dielectric barrier discharges
  • plasma agricultural applications

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Polymers and Plastics

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