HOLOGRAPHIC OBSERVATION OF DEFORMATION IN HEADER USED IN PLASTIC PACKAGE FOR HIGH OUTPUT POWER TRANSISTOR.

Nobuo Nishida, Hajime Suzuki, Kazuhiro Kosuge, Shoichi Koreeda, Seietsu Fukui

Research output: Contribution to journalArticlepeer-review

Abstract

This paper reports a solution to the problem involving cracks in high power transistor chips that appeared during package development. Header deformation observation by holographic interferometry indicated the cause of the chip cracking. The observation method is described. The reason for chip cracks is discussed and the performance of headers fabricated in order to prevent chip cracks is discussed.

Original languageEnglish
Pages (from-to)33-41
Number of pages9
JournalNEC Research and Development
Issue number46
Publication statusPublished - 1977 Jan 1
Externally publishedYes

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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