Hillock growth mechanism in Pt thin film

Translated title of the contribution: Hillock growth mechanism in Pt thin film

Yukihiro Kumagai, Hideo Miura, Hiromi Shimazu, Yuichi Matsui

Research output: Contribution to journalArticlepeer-review


The hillock growth mechanism at the surface of Pt/TiN electrode is investigated. Transmission electron microscopy shows that the hillock forms from delamination at the interface of Pt/TiN and plastic deformation of Pt film. Stress measurement in a Pt film shows that the hillock growth starts when the internal stress in a Pt film exceeds about - 1 GPa during high-temperature annealing. Since the stress in Pt film varies with deposition temperature from 500 MPa to -500 MPa, starting temperature of the hillock growth depends on the deposition temperature. Therefore, the stress control of Pt film is very important in order to eliminate hillock growth at the electrode surface.

Translated title of the contributionHillock growth mechanism in Pt thin film
Original languageJapanese
Pages (from-to)1996-2001
Number of pages6
JournalNihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A
Issue number637
Publication statusPublished - 1999
Externally publishedYes

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering


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