TY - GEN
T1 - Highly sensitive pressure sensor using two-dimensionally aligned carbon nanotube bundles
AU - Nozaki, Takuya
AU - Suzuki, Ken
AU - Miura, Hideo
PY - 2015/1/1
Y1 - 2015/1/1
N2 - A highly sensitive two-dimensional tactile sensor has been developed by applying the stain-induced change of the electronic resistance of MWCNTs (Multi-Wall Carbon Nano-Tubes). The elastic deformation of a bundle of MWCNTs was confirmed under the axial compressive strain from 0% to 60%, and the sensitivity of compressive force was 1 mN. The maximum gauge factor of the bundle under the compressive strain was about 100, and it was obtained from the buckling deformation of the bundle. Since the effective elastic constant of the bundle was about 140 kPa, it was important to use a very soft dielectric material for electrical isolation among areaarrayed fine bundles in the tactile sensor. The application of polydimethylsiloxane (PDMS) was found to be effective for assuring the flexible deformation of each bundle in the sensor under the application of a distributed load.
AB - A highly sensitive two-dimensional tactile sensor has been developed by applying the stain-induced change of the electronic resistance of MWCNTs (Multi-Wall Carbon Nano-Tubes). The elastic deformation of a bundle of MWCNTs was confirmed under the axial compressive strain from 0% to 60%, and the sensitivity of compressive force was 1 mN. The maximum gauge factor of the bundle under the compressive strain was about 100, and it was obtained from the buckling deformation of the bundle. Since the effective elastic constant of the bundle was about 140 kPa, it was important to use a very soft dielectric material for electrical isolation among areaarrayed fine bundles in the tactile sensor. The application of polydimethylsiloxane (PDMS) was found to be effective for assuring the flexible deformation of each bundle in the sensor under the application of a distributed load.
UR - http://www.scopus.com/inward/record.url?scp=84981240797&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84981240797&partnerID=8YFLogxK
U2 - 10.1115/IMECE2015-53059
DO - 10.1115/IMECE2015-53059
M3 - Conference contribution
AN - SCOPUS:84981240797
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
BT - Micro- and Nano-Systems Engineering and Packaging
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 2015 International Mechanical Engineering Congress and Exposition, IMECE 2015
Y2 - 13 November 2015 through 19 November 2015
ER -