A new etching technology was developed for micro/nanofabrication of 20% Fe-Ni, Au, Pt, and Cu. The etch selectivity of these metals with respect to titanium is such that titanium may be used, not only as a masking material, but also as an etch-stop layer. The titanium can be used both as a mask for the sputter etching of noble metals and as a mask for the reactive-ion etching of magnetic metals in CO/NH3/Xe plasmas.
|Number of pages||4|
|Journal||Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures|
|Publication status||Published - 2003 Sep 1|
ASJC Scopus subject areas
- Condensed Matter Physics
- Electrical and Electronic Engineering