Highly dependable 3-D stacked multicore processor system module fabricated using reconfigured multichip-on-wafer 3-D integration technology

K. W. Lee, H. Hashimoto, M. Onishi, S. Konno, Y. Sato, C. Nagai, J. C. Bea, M. Murugesan, T. Fukushima, T. Tanaka, M. Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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