Highly accurate management in dynamically changing fab

K. Imaoka, Y. Ishii, T. Kikuchi, Shigetoshi Sugawa, Akio Nagahira

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Semiconductor fab capability improvement is usually discussed in the context of static conditions. This paper focuses on rapidly changing fab in the midst of capability improvement and describes the fab operations that maximize throughput while maintaining the cycle time in such a dynamic environment. Turn and Move are defined as parameters that indicate daily operation performance. The manufacturing process is divided into several segments where the Turn is maintained uniformly in each segment, while the increased Move capability is sequentially-allocated and shifted from one segment to the next, from input side to output side of each manufacturing process. The effectiveness of this method has been demonstrated in a NOR Flash Memory Fab.

Original languageEnglish
Title of host publication2008 International Symposium on Semiconductor Manufacturing, ISSM 2008
Pages33-36
Number of pages4
Publication statusPublished - 2008 Dec 1
Event2008 17th International Symposium on Semiconductor Manufacturing, ISSM 2008 - Tokyo, Japan
Duration: 2008 Oct 272008 Oct 29

Other

Other2008 17th International Symposium on Semiconductor Manufacturing, ISSM 2008
Country/TerritoryJapan
CityTokyo
Period08/10/2708/10/29

ASJC Scopus subject areas

  • Engineering(all)

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