Highly accurate management in dynamically changing fab

Kazunori Imaoka, Yoshihiro Ishii, Tsuyoshi Kikuchi, Shigetoshi Sugawa, Akio Nagahira

Research output: Contribution to journalArticlepeer-review

Abstract

Semiconductor fab capability improvement is usually discussed in the context of static conditions. This paper focuses on a rapidly changing fab in the midst of capability improvement and describes the fab operations that maximize throughput while maintaining the cycle time in such a dynamic environment. Turn and Move are defined as parameters that indicate daily operation performance. The manufacturing process is divided into several segments, where the Turn is maintained uniformly in each segment while the increased Move capability is sequentially allocated and shifted from one segment to the next, from input side to output side of the manufacturing process. The effectiveness of this method has been demonstrated in a NOR flash memory fab.

Original languageEnglish
Article number5238562
Pages (from-to)482-490
Number of pages9
JournalIEEE Transactions on Semiconductor Manufacturing
Volume22
Issue number4
DOIs
Publication statusPublished - 2009 Nov 1

Keywords

  • Cycle time
  • Dispatching
  • Operation management
  • Semiconductor manufacturing
  • Throughput
  • Work in process (WIP) control

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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