High-throughput screening of thermoelectric materials; application of thermal probe method to composition-spread samples

Atsushi Yamamoto, Dmitry Kukuruznyak, Parhat Ahmet, Toyohiro Chikyow, Fumio S. Ohuchi

Research output: Contribution to journalConference articlepeer-review

6 Citations (Scopus)

Abstract

In this paper, we demonstrate the use of thermal probe method that is capable of mapping Seebeck coefficient, thermal conductivity and contact resistance on a micrometer scale. We show the successful screening example on pseudo binary (Bi 1-xSb x) 2Te 3 (0.5<x<1) bulk composition-spread sample prepared by conventional powder metallurgy process. Another demonstration is a novel attempt to combine the combinatorial PLD and the thermal probe method. A pseudo ternary diagram of nickel-copper-manganese oxides fabricated on Nb doped STO substrate was used for the screening. The mapping of electrical resistance over the ternary diagram yields a lot of information, which is essential for materials researches on complex, multi-composition systems.

Original languageEnglish
Pages (from-to)3-14
Number of pages12
JournalMaterials Research Society Symposium - Proceedings
Volume804
Publication statusPublished - 2003 Dec 1
Externally publishedYes
EventCombinatorial and Artificial Intelligence Methods in Materials Science II - Boston, MA., United States
Duration: 2003 Dec 12003 Dec 4

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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