High-temperature deformation behavior of SiC-AlN ceramic alloys with fine-grained microstructure

Yoshimasa Kobayashi, Jing Feng Li, Akira Kawasaki, Ryuzo Watanabe

Research output: Contribution to journalArticle

Abstract

It was recently found that SiC-AlN solid solutions can be formed over a wide compositional range and better mechanical properties were obtained particularly at room temperature for the SiC-AlN alloys than the end number materials. The present study was intended to investigate the high-temperature strength and deformation behavior of the SiC-AlN solid solution. For this purpose, superfine grained SiC-AlN solid solution and its composite samples were prepared by a reaction HIP-sintering process, and their fracture strength and deformation behavior were evaluated up to 1773K by using a newly-developed Small Punch (SP) testing method. It has been found that high fracture strength is obtained up to 1473K, and below this temperature the load-deflection curve is linear, indicating typically brittle behavior. At 1773K, plastic-like deformation behavior was observed and it intensified with decreasing strain rate. The fractographic observation suggested that the grain boundary sliding enhanced by the ultrafine grained-microstructure was predominately responsible for the appearance of the non-linear deformation at high temperature.

Original languageEnglish
Pages (from-to)421-425
Number of pages5
JournalFuntai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy
Volume43
Issue number4
DOIs
Publication statusPublished - 1996 Apr

Keywords

  • Deformation behavior
  • Fine-grained microstructure
  • High temperature strength
  • SiC-AlN system
  • Solid solution

ASJC Scopus subject areas

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering
  • Metals and Alloys
  • Materials Chemistry

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