High-temperature deformation behavior and microstructural characterization of high-Mn bearing titanium-based alloy

Saad Ebied, Atef Hamada, Wojciech Borek, Mohamed Gepreel, Akihiko Chiba

Research output: Contribution to journalArticle

12 Citations (Scopus)

Abstract

Ti-Mn alloys exhibit an excellent potential for biomedical applications as well as structural engineering applications, especially in the aerospace industry. In order to control and enhance grain structure during the manufacturing of Ti-Mn alloys and thereby help to enhance mechanical properties such as strength and toughness, we studied the hot-deformation behavior of βTi-10Mn alloys. Isothermal compression tests were conducted in the strain rate range of 0.01–10 s−1 and temperatures in the range of 850–1000 °C using a Gleeble thermomechanical simulator. High-temperature flow stress curves exhibited discontinuous yielding and pronounced periodic serrations without any strain hardening during compression straining of these alloys. Such peculiar behavior of this alloy is due to active dynamic strain aging in its β-bcc structure. Metallographic observations by electron-backscattered diffraction (EBSD) analysis revealed that dynamic recovery (DRV) is more active than continuous dynamic recrystallization (CDRX) when the alloy is deformed at high strain rates, i.e. higher than 1 s−1. Furthermore, the constitutive behavior of the alloy was modeled and the apparent hot-deformation activation energy of the alloy was estimated to be 243 kJ/mol, which is ~60% higher than the self-diffusion energy in pure titanium.

Original languageEnglish
Pages (from-to)176-185
Number of pages10
JournalMaterials Characterization
Volume139
DOIs
Publication statusPublished - 2018 May

Keywords

  • Deformation mechanism
  • Dynamic recovery
  • Dynamic recrystallization
  • Hot deformation
  • Thermomechanical processing
  • β-Titanium alloys

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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