High-speed TSV filling with molten solder

Young Ki Ko, Hiromichi T. Fujii, Yutaka S. Sato, Chang Woo Lee, Sehoon Yoo

Research output: Contribution to journalArticlepeer-review

22 Citations (Scopus)


A novel technique of vacuum-assisted via filling with molten solder was developed in this study. The diameter of the TSV was 30 μm and its depth was 100-200 μm. The vacuum pressure applied ranged from 0.02 to 0.08 MPa. Molten solder was filled into the via holes by pressure differences between the upper and lower side of Si wafer. The filling time for TSVs with diameter of 30 μm and depth of 200 μm was less than 4 s, which is much faster than conventional via filling techniques.

Original languageEnglish
Pages (from-to)62-64
Number of pages3
JournalMicroelectronic Engineering
Issue number1
Publication statusPublished - 2012 Jan 1


  • Filling
  • Reflow
  • Solder
  • TSV
  • Vacuum
  • Via
  • Wave soldering

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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