High spatial, temporal and temperature resolution thermal imaging method using Eu(TTA)3 temperature sensitive paint

Takashiro Tsukamoto; Masayoshi Esashi; Shuji Tanaka

doi:10.1088/0960-1317/23/11/114015

High spatial, temporal and temperature resolution thermal imaging method using Eu(TTA)₃ temperature sensitive paint

Takashiro Tsukamoto, Masayoshi Esashi, Shuji Tanaka

ENG - Robotics

Research output: Contribution to journal › Article › peer-review

7 Citations (Scopus)

Abstract

This paper reports on a novel non-contact thermal imaging method with high spatial, temporal and temperature resolution for microdevice evaluation. This method uses a temperature sensitive paint with europium (III) thenoyltrifluoroacetone (Eu(TTA)₃). The luminescence of Eu(TTA) ₃ was excited by a short pulsed UV light; a temporal resolution as high as 0.2 ms was achieved under normal CCD camera observation. Also, a spatial resolution of about 39 μm and a temperature fluctuation of about ±0.2 °C were demonstrated.

Original language	English
Article number	114015
Journal	Journal of Micromechanics and Microengineering
Volume	23
Issue number	11
DOIs	https://doi.org/10.1088/0960-1317/23/11/114015
Publication status	Published - 2013 Nov

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Mechanics of Materials
Mechanical Engineering
Electrical and Electronic Engineering

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10.1088/0960-1317/23/11/114015

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@article{a5b7346ec1684607a3d55c63b8920533,

title = "High spatial, temporal and temperature resolution thermal imaging method using Eu(TTA)3 temperature sensitive paint",

abstract = "This paper reports on a novel non-contact thermal imaging method with high spatial, temporal and temperature resolution for microdevice evaluation. This method uses a temperature sensitive paint with europium (III) thenoyltrifluoroacetone (Eu(TTA)3). The luminescence of Eu(TTA) 3 was excited by a short pulsed UV light; a temporal resolution as high as 0.2 ms was achieved under normal CCD camera observation. Also, a spatial resolution of about 39 μm and a temperature fluctuation of about ±0.2 °C were demonstrated.",

author = "Takashiro Tsukamoto and Masayoshi Esashi and Shuji Tanaka",

year = "2013",

month = nov,

doi = "10.1088/0960-1317/23/11/114015",

language = "English",

volume = "23",

journal = "Journal of Micromechanics and Microengineering",

issn = "0960-1317",

publisher = "IOP Publishing Ltd.",

number = "11",

}

TY - JOUR

T1 - High spatial, temporal and temperature resolution thermal imaging method using Eu(TTA)3 temperature sensitive paint

AU - Tsukamoto, Takashiro

AU - Esashi, Masayoshi

AU - Tanaka, Shuji

PY - 2013/11

Y1 - 2013/11

N2 - This paper reports on a novel non-contact thermal imaging method with high spatial, temporal and temperature resolution for microdevice evaluation. This method uses a temperature sensitive paint with europium (III) thenoyltrifluoroacetone (Eu(TTA)3). The luminescence of Eu(TTA) 3 was excited by a short pulsed UV light; a temporal resolution as high as 0.2 ms was achieved under normal CCD camera observation. Also, a spatial resolution of about 39 μm and a temperature fluctuation of about ±0.2 °C were demonstrated.

AB - This paper reports on a novel non-contact thermal imaging method with high spatial, temporal and temperature resolution for microdevice evaluation. This method uses a temperature sensitive paint with europium (III) thenoyltrifluoroacetone (Eu(TTA)3). The luminescence of Eu(TTA) 3 was excited by a short pulsed UV light; a temporal resolution as high as 0.2 ms was achieved under normal CCD camera observation. Also, a spatial resolution of about 39 μm and a temperature fluctuation of about ±0.2 °C were demonstrated.

UR - http://www.scopus.com/inward/record.url?scp=84887065244&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84887065244&partnerID=8YFLogxK

U2 - 10.1088/0960-1317/23/11/114015

DO - 10.1088/0960-1317/23/11/114015

M3 - Article

AN - SCOPUS:84887065244

VL - 23

JO - Journal of Micromechanics and Microengineering

JF - Journal of Micromechanics and Microengineering

SN - 0960-1317

IS - 11

M1 - 114015

ER -

High spatial, temporal and temperature resolution thermal imaging method using Eu(TTA)₃ temperature sensitive paint

Abstract

ASJC Scopus subject areas

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