TY - JOUR
T1 - High-resolution projection image reconstruction of thick objects by hard x-ray diffraction microscopy
AU - Takahashi, Yukio
AU - Nishino, Yoshinori
AU - Tsutsumi, Ryosuke
AU - Zettsu, Nobuyuki
AU - Matsubara, Eiichiro
AU - Yamauchi, Kazuto
AU - Ishikawa, Tetsuya
PY - 2010/12/2
Y1 - 2010/12/2
N2 - Hard x-ray diffraction microscopy enables us to observe thick objects at high spatial resolution. The resolution of this method is limited, in principle, by only the x-ray wavelength and the largest scattering angle recorded. As the resolution approaches the wavelength, the thickness effect of objects plays a significant role in x-ray diffraction microscopy. In this paper, we report high-resolution hard x-ray diffraction microscopy for thick objects. We used highly focused coherent x rays with a wavelength of ∼0.1 nm as an incident beam and measured the diffraction patterns of a ∼150-nm -thick silver nanocube at the scattering angle of ∼3°. We observed a characteristic contrast of the coherent diffraction pattern due to only the thickness effect and collected the diffraction patterns at nine incident angles so as to obtain information on a cross section of Fourier space. We reconstructed a pure projection image by the iterative phasing method from the patched diffraction pattern. The edge resolution of the reconstructed image was ∼2 nm, which was the highest resolution so far achieved by x-ray microscopy. The present study provides us with a method for quantitatively observing thick samples at high resolution by hard x-ray diffraction microscopy.
AB - Hard x-ray diffraction microscopy enables us to observe thick objects at high spatial resolution. The resolution of this method is limited, in principle, by only the x-ray wavelength and the largest scattering angle recorded. As the resolution approaches the wavelength, the thickness effect of objects plays a significant role in x-ray diffraction microscopy. In this paper, we report high-resolution hard x-ray diffraction microscopy for thick objects. We used highly focused coherent x rays with a wavelength of ∼0.1 nm as an incident beam and measured the diffraction patterns of a ∼150-nm -thick silver nanocube at the scattering angle of ∼3°. We observed a characteristic contrast of the coherent diffraction pattern due to only the thickness effect and collected the diffraction patterns at nine incident angles so as to obtain information on a cross section of Fourier space. We reconstructed a pure projection image by the iterative phasing method from the patched diffraction pattern. The edge resolution of the reconstructed image was ∼2 nm, which was the highest resolution so far achieved by x-ray microscopy. The present study provides us with a method for quantitatively observing thick samples at high resolution by hard x-ray diffraction microscopy.
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U2 - 10.1103/PhysRevB.82.214102
DO - 10.1103/PhysRevB.82.214102
M3 - Article
AN - SCOPUS:78650814181
VL - 82
JO - Physical Review B - Condensed Matter and Materials Physics
JF - Physical Review B - Condensed Matter and Materials Physics
SN - 0163-1829
IS - 21
M1 - 214102
ER -