High-resolution electron microscopy observation of grain-boundary films in superplastically deformed silicon nitride

Guo Dong Zhan, Mamoru Mitomo, Yuichi Ikuhara, Taketo Sakuma

    Research output: Contribution to journalArticlepeer-review

    8 Citations (Scopus)

    Abstract

    The thickness distribution of grain-boundary films during the superplastic deformation of fine-grained β-silicon nitride was investigated by high-resolution electron microscopy. In particular, grain-boundary thickness was considered with respect to the stress axis in two orientations; namely, parallel and perpendicular to the direction of applied stress. The results showed that the thickness distribution in boundaries perpendicular to the direction of applied stress was unimodal, whereas in parallel boundaries it was bimodal. Moreover, it was found that the majority of film-free boundaries were parallel to the direction of applied stress in the extremely deformed sample. The variation in spacing reflects distribution of stresses within the material due to irregular shape of the grams and the existence of percolating load-bearing paths through the microstructure.

    Original languageEnglish
    Pages (from-to)1551-1555
    Number of pages5
    JournalJournal of Materials Research
    Volume15
    Issue number7
    DOIs
    Publication statusPublished - 2000 Jan 1

    ASJC Scopus subject areas

    • Materials Science(all)
    • Condensed Matter Physics
    • Mechanics of Materials
    • Mechanical Engineering

    Fingerprint Dive into the research topics of 'High-resolution electron microscopy observation of grain-boundary films in superplastically deformed silicon nitride'. Together they form a unique fingerprint.

    Cite this