High-resolution electron microscopy observation of grain-boundary films in superplastically deformed silicon nitride

Guo Dong Zhan; Mamoru Mitomo; Yuichi Ikuhara; Taketo Sakuma

doi:10.1557/JMR.2000.0222

High-resolution electron microscopy observation of grain-boundary films in superplastically deformed silicon nitride

Guo Dong Zhan, Mamoru Mitomo, Yuichi Ikuhara, Taketo Sakuma

Research output: Contribution to journal › Article › peer-review

8 Citations (Scopus)

Abstract

The thickness distribution of grain-boundary films during the superplastic deformation of fine-grained β-silicon nitride was investigated by high-resolution electron microscopy. In particular, grain-boundary thickness was considered with respect to the stress axis in two orientations; namely, parallel and perpendicular to the direction of applied stress. The results showed that the thickness distribution in boundaries perpendicular to the direction of applied stress was unimodal, whereas in parallel boundaries it was bimodal. Moreover, it was found that the majority of film-free boundaries were parallel to the direction of applied stress in the extremely deformed sample. The variation in spacing reflects distribution of stresses within the material due to irregular shape of the grams and the existence of percolating load-bearing paths through the microstructure.

Original language	English
Pages (from-to)	1551-1555
Number of pages	5
Journal	Journal of Materials Research
Volume	15
Issue number	7
DOIs	https://doi.org/10.1557/JMR.2000.0222
Publication status	Published - 2000 Jan 1

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Access to Document

10.1557/JMR.2000.0222

Fingerprint Dive into the research topics of 'High-resolution electron microscopy observation of grain-boundary films in superplastically deformed silicon nitride'. Together they form a unique fingerprint.

Cite this

@article{83db16d5f8f145b1bb9124be50b47d9d,

title = "High-resolution electron microscopy observation of grain-boundary films in superplastically deformed silicon nitride",

abstract = "The thickness distribution of grain-boundary films during the superplastic deformation of fine-grained β-silicon nitride was investigated by high-resolution electron microscopy. In particular, grain-boundary thickness was considered with respect to the stress axis in two orientations; namely, parallel and perpendicular to the direction of applied stress. The results showed that the thickness distribution in boundaries perpendicular to the direction of applied stress was unimodal, whereas in parallel boundaries it was bimodal. Moreover, it was found that the majority of film-free boundaries were parallel to the direction of applied stress in the extremely deformed sample. The variation in spacing reflects distribution of stresses within the material due to irregular shape of the grams and the existence of percolating load-bearing paths through the microstructure.",

author = "Zhan, {Guo Dong} and Mamoru Mitomo and Yuichi Ikuhara and Taketo Sakuma",

year = "2000",

month = jan,

day = "1",

doi = "10.1557/JMR.2000.0222",

language = "English",

volume = "15",

pages = "1551--1555",

journal = "Journal of Materials Research",

issn = "0884-2914",

publisher = "Materials Research Society",

number = "7",

}

TY - JOUR

T1 - High-resolution electron microscopy observation of grain-boundary films in superplastically deformed silicon nitride

AU - Zhan, Guo Dong

AU - Mitomo, Mamoru

AU - Ikuhara, Yuichi

AU - Sakuma, Taketo

PY - 2000/1/1

Y1 - 2000/1/1

N2 - The thickness distribution of grain-boundary films during the superplastic deformation of fine-grained β-silicon nitride was investigated by high-resolution electron microscopy. In particular, grain-boundary thickness was considered with respect to the stress axis in two orientations; namely, parallel and perpendicular to the direction of applied stress. The results showed that the thickness distribution in boundaries perpendicular to the direction of applied stress was unimodal, whereas in parallel boundaries it was bimodal. Moreover, it was found that the majority of film-free boundaries were parallel to the direction of applied stress in the extremely deformed sample. The variation in spacing reflects distribution of stresses within the material due to irregular shape of the grams and the existence of percolating load-bearing paths through the microstructure.

AB - The thickness distribution of grain-boundary films during the superplastic deformation of fine-grained β-silicon nitride was investigated by high-resolution electron microscopy. In particular, grain-boundary thickness was considered with respect to the stress axis in two orientations; namely, parallel and perpendicular to the direction of applied stress. The results showed that the thickness distribution in boundaries perpendicular to the direction of applied stress was unimodal, whereas in parallel boundaries it was bimodal. Moreover, it was found that the majority of film-free boundaries were parallel to the direction of applied stress in the extremely deformed sample. The variation in spacing reflects distribution of stresses within the material due to irregular shape of the grams and the existence of percolating load-bearing paths through the microstructure.

UR - http://www.scopus.com/inward/record.url?scp=0034236066&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0034236066&partnerID=8YFLogxK

U2 - 10.1557/JMR.2000.0222

DO - 10.1557/JMR.2000.0222

M3 - Article

AN - SCOPUS:0034236066

VL - 15

SP - 1551

EP - 1555

JO - Journal of Materials Research

JF - Journal of Materials Research

SN - 0884-2914

IS - 7

ER -