High-performance ultra-small single crystalline silicon microphone of an integrated structure

T. Tajima, T. Nishiguchi, S. Chiba, A. Morita, M. Abe, K. Tanioka, N. Saito, M. Esashi

Research output: Contribution to journalConference articlepeer-review

33 Citations (Scopus)

Abstract

We have succeeded in fabricating an ultra-small condenser microphone that has excellent acoustic characteristics, and excellent reliability and mass-producibility, with an integrated structure made from single-crystalline silicon, a material that has high tensile strength. This is owing to the use of a bonded wafer, which is prepared using powder silicon oxide as a glue (SODIC method), and precise control of the thickness of the diaphragm, a thin film that vibrates under acoustic pressure. The microphone's acoustic characteristics are: wide dynamic range with excellent linearity up to 10 Pa, wide frequency range of 75 Hz-24 kHz, and high sensitivity of -47 dB (0 dB = 1 V/Pa). Since it is made of single-crystalline silicon, it is robust and thermally resistant. Moreover, it has suitability to mass production, because it is fabricated with a semiconductor process.

Original languageEnglish
Pages (from-to)508-519
Number of pages12
JournalMicroelectronic Engineering
Volume67-68
DOIs
Publication statusPublished - 2003 Jun 1
EventProceedings of the 28th International Conference on MNE - Lugano, Switzerland
Duration: 2002 Sep 162002 Sep 19

Keywords

  • Bonded wafer
  • Etch-stop
  • Silicon MEMS
  • Silicon microphone

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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