High performance flip chip package with higher mountability and longer interconnect life

Satoru Katsurayama, Hironori Tohmyoh, Masumi Saka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)


Generally, underfill material is adopted for encapsulation of flip chip package. And, the role of the underfill materials has become important day by day due to variant requirements for higher reliability of flip chip package. Also lower warpage gives higher mount-ability of the flip chip package and the small changes in the warpage of the package during the thermal cycle mitigate the stress working at the bump/substrate interface and bump/chip interface. Therefore, controlling the warpage of the flip chip package becomes very important problem for enhancing the performance of the package, i.e., the higher mount-ability and longer interconnect life. In this study, the effect of physical properties of underfill materials and substrates on the warpage behavior and the interconnect reliability of the flip chip package is reported. It was found from the experiments that the selection of an underfill and a substrate gave the highest interconnect reliability for the bump bonds. In addition to control the warpage behavior of the package during assembly, by selecting the suitable underfill material and substrate, the flip chip package with lower warpage and higher interconnect reliability can be realized.

Original languageEnglish
Title of host publicationProceedings of the ASME InterPack Conference 2009, IPACK2009
Number of pages5
Publication statusPublished - 2010
Event2009 ASME InterPack Conference, IPACK2009 - San Francisco, CA, United States
Duration: 2009 Jul 192009 Jul 23

Publication series

NameProceedings of the ASME InterPack Conference 2009, IPACK2009


Other2009 ASME InterPack Conference, IPACK2009
Country/TerritoryUnited States
CitySan Francisco, CA

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering


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